PACKAGING DEVICE, PACKAGING METHOD, AND PACKAGING BODY

摘要

A CPU of a packaging device holds a tip section of a film (S1). The CPU conveys a pedestal to a downstream side (S2). The CPU welds a first film part and a first pedestal part by heating a heater to a first temperature (S13). The CPU conveys the pedestal to the downstream side (S19). The CPU releases the hold on the tip part (S17). The CPU moves a press roller to the lowest position (S25). The CPU moves the pedestal to an upstream side (S29). The CPU sandwiches a second film part and a third film part in a state laminated by the heater. The CPU welds the second film part and the third film part by heating the heater to a second temperature.