| 发明名称 |
System for ultraviolet atmospheric seed layer remediation |
| 摘要 |
The present invention provides a system for removing organic contaminants (216) from a copper seed layer that has been deposited on a semiconductor substrate (206). The present invention provides a housing (204) to enclose the semiconductor substrate within. An ultraviolet radiation source (210) is disposed within the housing. A treatment medium (208) is also provided within the housing. The semiconductor substrate is enclosed within the housing and exposed to the treatment medium. The ultraviolet radiation source exposes the semiconductor substrate to ultraviolet radiation, desorbing the contaminants from the seed layer.
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| 申请公布号 |
US2005042886(A1) |
申请公布日期 |
2005.02.24 |
| 申请号 |
US20030645679 |
申请日期 |
2003.08.21 |
| 申请人 |
FRANK AARON;GONZALEZ DAVID;DEGENOVA JOHN;RAGHAVAN SRINIVAS;RAMAPPA DEEPAK A. |
发明人 |
FRANK AARON;GONZALEZ DAVID;DEGENOVA JOHN;RAGHAVAN SRINIVAS;RAMAPPA DEEPAK A. |
| 分类号 |
H01L21/28;B08B7/00;C25D5/34;C25D7/12;H01L21/00;H01L21/288;H01L21/304;H01L21/321;H01L21/768;(IPC1-7):H01L21/31 |
主分类号 |
H01L21/28 |
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