发明名称 BARREL PLATING METHOD AND METHOD FOR MANUFACTURING ELECTRONIC PARTS
摘要 PROBLEM TO BE SOLVED: To provide a barrel plating method for forming a uniform plated film on an article to be plated such as an outer electrode of electronic parts, in a short period. SOLUTION: The barrel plating method for electrolytically forming a plated film on the surface of the article which has been charged into a barrel, while rotating the barrel, comprises: the first step of forming the plated film into a predetermined thickness with the first current; and the second step of subsequently switching the current to the second current having higher current density than the first current, and forming the plated film into a predetermined thickness with the second current. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006342390(A) 申请公布日期 2006.12.21
申请号 JP20050168777 申请日期 2005.06.08
申请人 TDK CORP 发明人 WATANABE HIDETOSHI;KONNO MASAHIKO;KAMIBAYASHI YOSHIHIRO;SATO DAIKI;ABE YUKIMARE;HASEBE MASARU;MASUDA IZUMI;SHIBUYA KAZUHIRO
分类号 C25D21/12;C25D7/00;C25D17/16;H01G4/12;H01G4/30 主分类号 C25D21/12
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