PROCESS FOR PRODUCING METAL WIRING BOARD

摘要

A process for producing a metal wiring board having a heat resistant resin board and, superimposed thereon, a metal wiring having its surface on the board superimposition side treated with at least one metal selected from among Ni, Cr, Co, Zn, Sn and Mo or an alloy containing at least one of these metals (hereinafter referred to as surface treatment metal). This process comprises the step of forming the metal wiring on the resin board and the washing step of washing at least a surface of the resin board with an etchant capable of removing of the surface treatment metal to thereby increase the adherence of the resin board surface. The thus produced metal wiring board excels in adhesion with adhesives for bonding, to films, of IC chips or anisotropically conductive films.