| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive photosensitive polyamideimide resin composition which excels in sensitivity, resolution, adhesion in development, and heat resistance, can be exposed with an i-line and developed with an alkaline aqueous solution, and yields a pattern of a good profile, a method for producing a pattern and an electronic component. <P>SOLUTION: The positive photosensitive polyamideimide resin composition comprises a polyamideimide (A) soluble in an alkaline aqueous solution and obtained by reacting a diamine (a1) having a phenolic hydroxyl group with a tricarboxylic acid monoanhydride (a2) and reacting the resulting diimidodicarboxylic acid with a diisocyanate (a3), a compound (B) which generates an acid under light, a solvent (C), and a compound (D) having an organic group convertible to a carboxylic acid by acid catalysis. The electronic component has a layer of a pattern as an interlayer insulation film layer or a surface protective film layer in an electronic device. <P>COPYRIGHT: (C)2007,JPO&INPIT |
