发明名称 BOOKLET WITH IC CHIP
摘要 <P>PROBLEM TO BE SOLVED: To offer a booklet with an IC chip using a resource saving IC inlay as a component of the booklet with an IC chip, capable of being made by a simplified manufacturing process, excellent in IC encoding stability and free from damages on the chip when the booklet is conveyed and printed through the printer and provided with a preventive measure against fraudulent reading. <P>SOLUTION: The booklet with an IC chip 1 is equipped with the antenna 22 on the base material sheet 10 and an IC inlay 20 having an IC chip 21 making non-contact communication with the external unit using the antenna. The base material sheet 10 is made of paper or the paper-like synthetic material, and the IC inlay 20 is composed with the IC chip 21 pasted with the adhesive material on the base material sheet 10, and the IC inlay 20 is pasted with the adhesive material at the approximate center on the face cover 13 or inside surface of the back cover or on any page of the booklet. A metal foil is applied to the inside of the back cover 12. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008087396(A) 申请公布日期 2008.04.17
申请号 JP20060272632 申请日期 2006.10.04
申请人 TOPPAN PRINTING CO LTD 发明人 YOSHINO TORU;SEKI KANAKO;SHIMA KAZUNOBU
分类号 B42D1/00;G06K19/07;G06K19/073;G06K19/077;H04B1/59;H04B5/02 主分类号 B42D1/00
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