| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent a conductive material sheet from being damaged, and to store the conductive material sheet efficiently. <P>SOLUTION: A manufacturing method of a semiconductor device 1 in which an electronic element 11 and leads 101, 102, 103 are sealed with resin comprises: a process for forming the plurality of leads 101, 102, 103 corresponding to the plurality of semiconductor devices 1 on the conductive material sheet 20; a process for arranging the electronic element 11 at a prescribed position of the conductive material sheet 20; a process for sealing the electronic element 11 and the leads 101, 102, 103 with resin; and a process for forming a plurality of columnar resin masses 14 at a region that does not compose the semiconductor device 1 within the plane of the conductive material sheet 20 in resin-sealing. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
