| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device for refilling a sampling hole formed by taking out a microsampling piece in a short time. SOLUTION: The sampling hole 12 from which the microsampling piece is closed by films 17 and 18 supported on a wall surface at the upper part of the hole 12 while leaving a void 19 in the inside. COPYRIGHT: (C)2009,JPO&INPIT |
