发明名称 |
INTEGRATED CIRCUIT HAVING SLOT VIA AND METHOD OF FORMING THE SAME |
摘要 |
An integrated circuit includes a first conductive line on the first metal level of the integrated circuit. The integrated circuit further includes a second conductive line on the second metal level of the integrated circuit. The integrated circuit further includes a slot via which electrically connects the first conductive line and the second conductive line. The slot via is overlapped with first conducive line and the second conductive line. The slot via is extended beyond the periphery of at least one of the first conductive line and the second conductive line. So, the power consumption of the integrated circuit can be reduced. |
申请公布号 |
KR20160089842(A) |
申请公布日期 |
2016.07.28 |
申请号 |
KR20150089013 |
申请日期 |
2015.06.23 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
LIN WEI CHENG;YOUNG CHARLES CHEW YUEN;TZENG JIANN TYNG;NARAYANASETTI PRANEETH |
分类号 |
H01L21/768;H01L23/48 |
主分类号 |
H01L21/768 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|