发明名称 COMPONENT BUILD-IN WIRING BOARD AND MANUFACTURING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a component built-in wiring board excellent in electrical connection reliability of a built-in electronic component electrode and a wiring conductor.SOLUTION: A component built-in wiring board 10 includes an insulation plate 1a having a through hole 7 for housing an electronic component 3, the electronic component 3 housed in the through hole 7, having a terminal 3a only on one principal surface of the insulation plate 1a, and a height smaller than the thickness of the insulation plate 1a, a filling resin 8 filling the space other than the electronic component 3 in the through hole 7, where one principal surface and the other principal surface of the insulation plate 1a are flat polished surface, an insulation layer 1b laminated on one principal surface of the insulation plate 1a in close contact with the polished surface of the filling resin 8, and having a via hole 6 where the terminal 3a is the bottom face, and a wiring conductor 4 formed in the via hole 6 so as to be connected with the terminal 3a. In the electronic component 3, the terminal 3a is located in the through hole 7 while being recessed below the polished surface of one principal surface.SELECTED DRAWING: Figure 1
申请公布号 JP2016207763(A) 申请公布日期 2016.12.08
申请号 JP20150085733 申请日期 2015.04.20
申请人 KYOCERA CORP 发明人 SAKURAI KEIZO;ISHIOKA TAKU;KAWAGOE ATSUO
分类号 H05K3/46;H01L23/12;H05K3/00 主分类号 H05K3/46
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