| 摘要 |
A method of forming a RFID device includes placing a patterned release layer on an RFID device substrate for use as a stencil. The release layer covers the portions of the RFID device substrate upon which conductive material is not to be placed, in the formation of a patterned layer, such as for formation of an antenna. The release layer may be formed by selectively printing a suitable liquid on portions of the RFID device substrate. Following placement of the release layer, a layer of metal is deposited on the release layer and the open portions of the RFID device substrate. The release layer and the metal overlying the release layer are then removed, leaving the desired pattern of metal of the RFID device substrate (a negative image of the pattern of the release layer).
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