| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for airtightly sealing a piezoelectric element package, of which method can seal at a relatively low temperature and secure a sufficient airtightness. SOLUTION: A metallic paste for sealing comprises a metallic powder and an organic solvent, wherein the metallic powder is at least one metallic powder selected from gold powder, silver powder, platinum powder and palladium powder having a purity of≥99.9% by weight and an average particle size of 0.1μm to 1.0μm, and the formulation proportion of the metallic powder to the organic solvent is 85 to 93% by weight to 5 to 15% by weight. The metallic paste preferably contains an additive such as a surfactant according to the coating method. The sealing method using the metallic paste includes a method in which the metallic paste is applied/dried, and sintered at 80 to 300°C to make a metallic powder sintered compact, and thereafter, a base member and a cap member are pressed while the metallic powder sintered compact is being heated. COPYRIGHT: (C)2008,JPO&INPIT
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