| 摘要 |
PROBLEM TO BE SOLVED: To provide a supporting member capable of stably mounting a solder ball to a substrate even though a semiconductor chip is not partially mounted and intervals between the semiconductor chips are narrow. SOLUTION: The supporting member of this invention for supporting a substrate 20 from its one side with a plurality of semiconductor chips 1 mounted at the time of mounting a solder ball 41 on the other side is arranged at the position respectively facing to the base member 10 and the plurality of semiconductor chips 1, is provided onto the base member 10 through an elastic member 15, and comprises a plurality of pressing up members 14 for supporting the substrate 20 through the plurality of semiconductor chips 1. The settling down amount of the pressing up member 14 at the time of supporting the substrate 20 is not less than the thickness of the semiconductor chip 1. COPYRIGHT: (C)2008,JPO&INPIT
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