| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To reduce the profile of a photoelectric converter which is used in a portable telephone terminal in order to perform communication between two main substrates by an optical signal. <P>SOLUTION: In headers 23 and 24 to be fitted to sockets 21 and 22 mounted on a main substrate, a sub-substrate (mount substrate) is conventionally used and mounted on the headers 23 and 24 after photoelectric conversion elements 26 and 27 and drivers IC 28 and 29 are mounted on the sub-substrate. Owing to this invention, they are flip-chip mounted directly on the headers 23 and 24 and since the photoelectric conversion elements 26 and 27 transmit or receive an optical signal in the thickness direction, a mirror member 25d is provided at the end of a waveguide 25b coupled with the headers 23 and 24 so that the light is reflected in the surface direction to enter or exit the waveguide 25b. Consequently, the profile of about 2 mm can be reduced to about 1 mm when the sub-substrate is used. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
