发明名称 METHOD AND APPARATUS FOR WET SURFACE TREATMENT
摘要 PROBLEM TO BE SOLVED: To provide a method and an apparatus for wet surface treatment, which are suitable for wet surface treatment of a workpiece. SOLUTION: The wet surface treatment method comprises a step of conducting a wet surface treatment of the workpiece (tubular body 6) fixed onto a rotating shaft 7, provided that the workpiece is rotated in the direction of gravitational force or obliquely with respect to the direction of gravitational force by rotating the rotating shaft 7 before, during or after the wet surface treatment. The workpiece has one or a plurality of apertures through which liquid can go in and out from the workpiece. The wet surface treatment apparatus (electroplating apparatus 1) has the rotating shaft 7 whose central axis of rotation is perpendicular to or inclined from the direction of gravitational force, a rotating drive member 8 that rotates the rotating shaft 7, rod-shaped plating anodes 2 with spring property or flexibility which are located on a peripheral surface of the rotating shaft 7 and rotates with the rotating shaft 7, cathode jigs 9 which are located on the peripheral surface of the rotating shaft 7 and rotates with the rotating shaft 7 and a non-rotating second plating anode 10 that is located apart from the rotating shaft 7. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009084659(A) 申请公布日期 2009.04.23
申请号 JP20070258739 申请日期 2007.10.02
申请人 KURODA SEISAKUSHO:KK;CANNING JAPAN KK;MIYATA:KK 发明人 FUJINO AKINORI;SHIBATA MITSUO;HARADA HIROSHI
分类号 C25D17/00;C23C18/31;C25D7/00;C25D17/06;C25D17/08;C25D17/12;C25D21/00;C25D21/10 主分类号 C25D17/00
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