Cleaning Flux, Cleaning Solder Paste, and Solder Joint

摘要

A cleaning flux contains as a solvent 60-98% by weight of one or both of an alkylene oxide-resorcinol copolymer and an ethylene oxide-propylene oxide condensation-added alkylene diamine. An addition amount of the alkylene oxide-resorcinol copolymer is within a range of 0-98% by weight and the addition amount of the ethylene oxide-propylene oxide condensation-added alkylene diamine is within the range of 0-98% by weight. The cleaning flux further includes one or both of an organic acid and a halogen compound. The addition amount of the organic acid is within the range of 0-18% by weight and the addition amount of the halogen compound is within the range of 0-4% by weight.

主权项

1. A cleaning flux comprising a solvent having a polarity of dissolving a flux component and a boiling point of 330° C. or higher wherein a volatilization volume occurred at a reflow soldering process is equal to or less than 20% of the whole flux volume.