| 摘要 |
The invention relates to a contact arrangement of at least one semiconductor component, in particular a power semiconductor component. According to the invention, an electrical connection of the semiconductor component has a metal coating made of Al or an Al alloy. Furthermore, the electrical connection is connected to at least one wire bond or strip bond made of Cu or a Cu alloy. A contact element, a bottom side of which is connected to the electrical connection and a top side of which is connected to the wire bond or strip bond, is located between the at least one electrical connection and the wire bond or strip bond. The contact element additionally has at least two adjoining layers, the bottom side being formed by an Al or Al alloy layer, and the contact element comprises at least one other layer made of Cu or a Cu alloy, Ag or an Ag alloy, and/or Ni or a Ni alloy. |
