| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an easy-to-produce surface protection tape which can be used consistently from a rear surface grinding process to an insulating film forming process and a rear surface wiring forming process while preventing occurrence of a smeared portion on a semiconductor wafer. <P>SOLUTION: The surface protection tape 21 being stuck onto a semiconductor wafer 24 includes a substrate layer 22 and an adhesive layer 23 wherein a cut 25 is formed in the surface of the substrate layer 22 opposite to the surface touching the adhesive layer 23. When such a cut 25 is formed in the substrate layer 22, the surface protection tape can be stuck up to the peripheral portion of the semiconductor wafer 24 having a curvature and the semiconductor wafer can be prevented from being smeared due to leakage of solution such as etching liquid. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
