发明名称 |
PHENOL POLYMER, PRODUCTION METHOD THEREOF AND USE THEREOF |
摘要 |
Disclosed is a phenol polymer having flame retardance, fast curability and low melt viscosity, which is useful as a curing agent for epoxy resin-based semiconductor sealing materials. Also disclosed are a method for producing such a phenol polymer and use of such a phenol polymer. Specifically disclosed is a phenol polymer obtained by reacting a phenol, a bismethylbiphenyl compound and an aromatic aldehyde at such a ratio that the molar ratio of the total of the bismethylbiphenyl compound and the aromatic aldehyde relative to the phenol is 0.10-0.60 and the aromatic aldehyde/the bismethylbiphenyl compound (molar ratio) is from 5/95 to 50/50. Also specifically disclosed is an epoxy resin composition composed of such a phenol polymer and an epoxy resin.
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申请公布号 |
WO2007043684(A1) |
申请公布日期 |
2007.04.19 |
申请号 |
WO2006JP320581 |
申请日期 |
2006.10.16 |
申请人 |
AIR WATER INC.;MURATA, KIYOTAKA;SONE, YOSHIHISA |
发明人 |
MURATA, KIYOTAKA;SONE, YOSHIHISA |
分类号 |
C08G14/04;C08G59/62 |
主分类号 |
C08G14/04 |
代理机构 |
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代理人 |
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地址 |
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