| 摘要 |
An integrated circuit ( 300/400 ) includes first and second power domains and a bank of input/output (I/O) cells ( 305/405 ) coupled to the first and second power domains. The bank of I/O cells ( 305/405 ) includes a first plurality of active clamps ( 374/445 ) for the first power domain and a second plurality of active clamps ( 384/425 ) for the second power domain wherein the first ( 374/445 ) and second ( 384/425 ) pluralities of active clamps overlap along the bank of I/O cells. According to one aspect each of the plurality of input/output cells ( 420, 440 ) has a bonding pad ( 421, 441 ) for receiving an output signal referenced to a respective first power domain, and at least one ESD protection element ( 425, 445 ) for a respective second power domain. According to another aspect, each of the plurality of input/output cells ( 420, 440 ) has a bonding pad ( 421, 441 ) for receiving a respective output signal and at least one ESD protection element for each of a first power domain and a second power domain.
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