| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition forming a film having physical properties after curing equal to those of a film cured at a high temperature, a method for producing a pattern and electronic components. <P>SOLUTION: The photosensitive resin composition comprises (a) a copolymer of a polybenzoxazole precursor having a structural unit A and a structural unit B represented by formula (I), (b) a photosensitizing agent and (C) a solvent, wherein U, V, W and X each represent a divalent organic group, provided that U and W are different groups and/or V and X are different groups; j and k represent the molar fractions of the structural unit A and the structural unit B, respectively, provided that the sum of j and k is 100 mol%; and at least one of U and V is a group containing a predetermined structure. <P>COPYRIGHT: (C)2008,JPO&INPIT |
