发明名称 RESIN COMPOSITION, HEAT CONDUCTIVE SHEET, HIGHLY HEAT CONDUCTIVE ADHESIVE SHEET WITH METAL FOIL AND HIGHLY HEAT CONDUCTIVE ADHESIVE SHEET WITH METAL PLATE
摘要 PROBLEM TO BE SOLVED: To provide a resin composition having excellent heat-curability, to provide a heat conductive sheet and a highly heat conductive adhesive sheet with a metal foil having excellent heat conductivity, heat resistance, etc., and good adhesion operation efficiency and to provide a highly heat conductive adhesive sheet with a metal plate, etc. SOLUTION: The resin composition comprises an epoxy resin and an inorganic filler and further contains a curing accelerator so as to heat-cure the epoxy resin. In the resin composition, an inorganic filler containing a boron trioxide component is used as the inorganic filler. A boron trifluoride-based curing accelerator is used as the curing accelerator. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008088406(A) 申请公布日期 2008.04.17
申请号 JP20070172590 申请日期 2007.06.29
申请人 NITTO SHINKO KK 发明人 UTSUNOMIYA NAOKI;YONEMURA HIROYUKI
分类号 C08L63/00;B32B15/092;C08G59/72;C08K3/38;C09J7/00;C09J7/02;C09J11/04;C09J11/06;C09J163/00;H01L23/373 主分类号 C08L63/00
代理机构 代理人
主权项
地址