摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition having excellent heat-curability, to provide a heat conductive sheet and a highly heat conductive adhesive sheet with a metal foil having excellent heat conductivity, heat resistance, etc., and good adhesion operation efficiency and to provide a highly heat conductive adhesive sheet with a metal plate, etc. SOLUTION: The resin composition comprises an epoxy resin and an inorganic filler and further contains a curing accelerator so as to heat-cure the epoxy resin. In the resin composition, an inorganic filler containing a boron trioxide component is used as the inorganic filler. A boron trifluoride-based curing accelerator is used as the curing accelerator. COPYRIGHT: (C)2008,JPO&INPIT |