| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which an underfill resin injection performance is improved, and the size of a fillet to be formed is reduced. SOLUTION: Small chip side dummy bumps 4, smaller than bumps, are formed on the periphery of a chip 1 and a flip chip is mounted on a substrate 2, thus reducing the gaps between dummy bumps 4 and the substrate 2, and between dummy bumps 4. As a result, capillary action at the gaps facilitates the injection of the underfill resin, thus reducing the amount of coating. COPYRIGHT: (C)2008,JPO&INPIT |
