| 摘要 |
PROBLEM TO BE SOLVED: To provide a flexible copper-clad laminate which is superior in dimensional stability against the environmental change in temperature and humidity of a polyimide resin layer, high in adhesive strength between a very thin copper foil and the polyimide resin layer, and suitable for a semi-additive construction method. SOLUTION: The flexible copper-clad laminate has the polyimide resin layer and the very thin copper foil 1-8μm in thickness derived from the very thin copper foil which is laminated on at least one side of the polyimide resin layer with a carrier wherein the very thin copper foil is formed on the carrier via a peeling layer. The polyimide resin layer has a low humidity expandable polyimide resin layer having a linear humidity expansion coefficient of 20 ppm/%RH or below and a linear thermal expansion coefficient of 25 ppm/K or below. COPYRIGHT: (C)2008,JPO&INPIT |
