| 摘要 |
PROBLEM TO BE SOLVED: To suppress defects such as breakage of an electronic device, a defect in electric conduction, and insufficient sealing, in an electronic component package formed by electrically connecting and sealing a large number of electronic devices at the same time on a wafer level and then dividing them into individual pieces. SOLUTION: A device wafer 101 having a plurality of electronic devices 2 and a cover wafer 103 covering the electronic device formed surface thereof are joined together with materials of first seal portion 9, a second seal portion 10 is formed on the outer peripheral side of each seal portion 9, and the device wafer and cover wafer are divided along dicing lines 7 passing second seal portions 10. Airtight sealing can be achieved over the entire wafer surface by the first seal portions 9 without requiring a large load. Second seal portions receive loads during the division, so chipping hardly occurs. COPYRIGHT: (C)2009,JPO&INPIT
|
