发明名称 OLED PACKAGING STRUCTURE AND PACKAGING METHOD THEREFOR
摘要 An OLED packaging structure and a packaging method therefor. The structure comprises a packaging cover (1), a substrate (2) arranged opposite the packaging cover (1), an OLED component (21) arranged between the packaging cover (1) and the substrate (2) and arranged on the substrate (2), a metal oxide layer (22) formed on the surface of the OLED component (21), a framing adhesive (12) arranged around the periphery of the OLED component and bonding the packaging cover (1) and the substrate (2), a desiccant filling (13) filled in the internal space enclosed by the framing adhesive (12) between the packaging cover (1) and the substrate (2) and covering the OLED component (21), and a piece of fused glass (11) arranged around the periphery of the framing adhesive (12) and bonded to the packaging cover (1) and the substrate (2). By using the framing adhesive (12) and the fused glass (11) for packaging and at the same time filling the desiccant filing (13) within the framing adhesive (12), the packaging structure is provided with great seal tightness and mechanical strength, and, with the metal oxide layer (22) formed on the surface of the internal OLED component (21), prevented is the problem of uneven display brightness due to corrosion of a light-emitting component by the desiccant filling (13) and in particular a liquid-state desiccant.
申请公布号 WO2016086537(A1) 申请公布日期 2016.06.09
申请号 WO2015CN72485 申请日期 2015.02.09
申请人 SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. 发明人 ZENG, WEIJING;WANG, YIFAN
分类号 H01L51/52;H01L51/56 主分类号 H01L51/52
代理机构 代理人
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