| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can sufficiently inhibit pad separation and poor connection.SOLUTION: A semiconductor device of the present embodiment includes: first wiring 15 located on a first insulation film 11; a second insulation film 16 located on the first wiring and the first insulation film; second wiring 20 located on the second insulation film; a third insulation film 21 located on the second wiring and the second insulation film; a barrier layer 24 located on the third insulation film; a pad 30 located on the barrier layer and the third insulation film; a fourth insulation film 28 located on the pad and the third insulation film; and an opening 28a which is formed in the fourth insulation film and located on the pad, in which there are no barrier layer and no second wiring but there is the first wiring under the pad located under the opening.SELECTED DRAWING: Figure 1 |
