| 摘要 |
The present invention addresses the problem of providing a semiconductor inspection circuit capable of connection state testing for, for example, a power supply, ground, or signal bump, in a product operation state in a semiconductor package or printed circuit board equipped with semiconductor LSI. The means for addressing this problem has a route-switchable circuit in a driver/receiver input unit and a mechanism capable of conveying output from a route switching circuit near a receiver circuit to a voltage waveform circuit with built-in variable termination, monitors the DC level at a termination having a fixed DC resistance during signal bump connection state observation, inputs a step wave during I/O power supply bump connection state observation, observes the resulting response waveform, and thereby makes it possible to observe a bump break condition in a product operation state. |
