METHOD FOR REPAIRING AN EQUIPMENT PIECE USED IN SEMICONDUCTOR PROCESSING

摘要

A method for the repairing a semiconductor processing piece utilized in a semiconductor processing chamber. The process includes the steps of machining off a portion of the semiconductor processing piece to form a machined surface, positioning a new part over the machined surface to replace the portion, placing a braze layer between the new part and the machined surface and heating at least the brazing layer to form a hermetic joint between the new part and the semiconductor processing piece. The semiconductor processing piece may be a heater or an electrostatic chuck. The joint material is adapted to later withstand the environments within a process chamber during a semiconductor manufacturing process.