发明名称 研磨用組成物及び基板の製造方法
摘要 PROBLEM TO BE SOLVED: To provide a polishing composition which can easily exhibit both an effect for enhancing the polishing speed and an effect for enhancing the wettability of a polished surface, and to provide a manufacturing method for a substrate.SOLUTION: A polishing composition contains a water-soluble polymer having a weight-average molecular weight of 1000000 or less, and a molecular weight distribution of 5.0-8.0 represented by weight-average molecular weight (Mw)/number-average molecular weight (Mn). Preferably, the polishing composition further contains at least one kind of salt selected from organic salts and inorganic salts. A manufacturing method of a substrate includes a polishing step for polishing a substrate by using a polishing composition containing a water-soluble polymer having a weight-average molecular weight of 1000000 or less, and a molecular weight distribution of 5.0-8.0 represented by weight-average molecular weight (Mw)/number-average molecular weight (Mn).
申请公布号 JP6029895(B2) 申请公布日期 2016.11.24
申请号 JP20120191900 申请日期 2012.08.31
申请人 株式会社フジミインコーポレーテッド 发明人 土屋 公亮;▲高▼橋 修平
分类号 H01L21/304;C09K3/14 主分类号 H01L21/304
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