| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting adhesive sheet excellent in laser mark visibility and alignment mark recognizability, and a method for manufacturing a semiconductor device using the thermosetting adhesive sheet.SOLUTION: A thermosetting adhesive sheet contains a thermosetting binder, a light-transmitting filler having an average primary particle size of 1 nm or more and 1,000 nm or less, and a coloring agent. The content of the light-transmitting filler is 30 pts.mass or more and 100 pts.mass or less with respect to 80 pts.mass of the thermosetting binder, and the content of the coloring agent is 0.5 pt.mass or more and 3.0 pts.mass or less with respect to 80 pts.mass of the thermosetting binder. Before a semiconductor wafer is diced, the thermosetting adhesive sheet is bonded to a polished surface of the semiconductor wafer to be cured. Thus, laser-marked printing is clear, so that excellent laser mark visibility can be obtained, and, in addition, accurate alignment using infrared rays can be performed.SELECTED DRAWING: Figure 1 |
