| 摘要 |
A stacked memory card comprises an upper memory card 20 and a lower memory card 22. The upper memory card and the lower memory card each comprise a heat sink 28, 50, at least one memory chip 26, 48 encapsulated by a glue layer 30, 52, a plurality of gold fingers 38, 60 in electrical contact with contacts 36, 58 and through holes 40, 62 filled with metal 42, 64. The heat sinks are stacked against each other. The gold fingers are used to connect the memory card to an electric device.
|
