发明名称 PHOTOSENSITIVE FILM AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD USING SAME
摘要 <p>Disclosed is a photosensitive film comprising a supporting body, a cushion layer which is formed on the supporting body and contains a first polymer, and a photosensitive layer which is formed on the cushion layer and contains a second polymer. The interaction parameter between the first polymer and the second polymer is not more than 0.40, and the cushion layer and the photosensitive layer are obtained by sequentially applying a coating liquid containing the first polymer and a coating liquid containing the second polymer over the supporting body in this order and drying them. By using this photosensitive film, formation of an air gap between a substrate for circuit formation and the photosensitive film can be sufficiently suppressed when the photosensitive film is superposed on the substrate while achieving a sufficiently high resolution. Furthermore, this photosensitive film can be formed by a simple process at low cost.</p>
申请公布号 WO2005071487(A1) 申请公布日期 2005.08.04
申请号 WO2005JP00877 申请日期 2005.01.24
申请人 HITACHI CHEMICAL CO., LTD.;YOSHIZAKO, KIMIHIRO;CHIBA, TOSHIAKI;HORIUCHI, KOUHEI 发明人 YOSHIZAKO, KIMIHIRO;CHIBA, TOSHIAKI;HORIUCHI, KOUHEI
分类号 G03F7/11;H05K3/06;(IPC1-7):G03F7/004 主分类号 G03F7/11
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