METHOD FOR MANUFACTURING THERMALLY CONDUCTIVE SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To simplify a process for manufacturing a thermally conductive substrate by sticking a thermosetting resin composition directly to a metal plate for heat dissipation. SOLUTION: A soft thermosetting resin composition 1 is applied onto a planar metal plate 14 for heat dissipation and then a planar lead frame 2 is applied to the side of the thermosetting resin composition opposite to the metal plate 14 thus forming a thermally conductive substrate 21. Since the thermosetting resin composition is stuck directly to the metal plate for heat dissipation, the process can be simplified. COPYRIGHT: (C)2006,JPO&NCIPI