发明名称 |
Side-emitting LED package and manufacturing method of the same |
摘要 |
The invention relates to a side-emitting LED package and a manufacturing method of the same. The invention provides a side-emitting LED package for emitting light from a light source sideward including a substrate with an electrode formed thereon. The package also includes a light source disposed on the substrate, a molded part that covers and protects the substrate with the light source thereon, and a reflective layer that covers an outer surface of the molded part. The molded part with the reflective layer forms a light transmitting surface in one side thereof. The invention allows easy manufacture of a reflecting surface in a desired shape, miniaturization regardless of the LED chip size, mass-production in an LED array, significantly improving productivity.
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申请公布号 |
US2006284203(A1) |
申请公布日期 |
2006.12.21 |
申请号 |
US20060444397 |
申请日期 |
2006.06.01 |
申请人 |
SUMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
HAN KYUNG T.;HAHM HUN J.;KIM DAE Y.;AHN HO S.;HAN SEONG Y.;PARK YOUNG S.;LEE SEON G. |
分类号 |
H01L33/50;H01L33/54;H01L33/56;H01L33/62 |
主分类号 |
H01L33/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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