Flip-chip mounting electronic component and method for producing the same, circuit board and method for producing the same, method for producing package

摘要

A method for producing a flip-chip mounting electronic component having plural terminals ( 3 ) dotted on a mounting face ( 1 ) and conductors formed on the terminals ( 3 ) realizes flip-chip mounting capable of shortening the distance between bumps ( 7 ). To realize this, a step of coating the mounting face ( 1 ) with a conductor having a predetermined thickness, a step of masking corresponding positions for the terminal ( 3 ) parts on the conductor surface, and a step of removing the conductor except the mask ( 6 ) parts are included and performed in this order. The bump is preferably constituted of copper.