| 摘要 |
<P>PROBLEM TO BE SOLVED: To suppress a change in reflection factor of a light with time lapse on the side of a substrate, and to improve a reflection factor adjacent to a light emitting element than heretofore. <P>SOLUTION: The light emitting device includes a plate-like sub-mount 3 which is mounted to a substrate 4 while an LED chip 2 is being mounted on its mounting surface and wherein a sub-mount wiring part 3a electrically connected with the LED chip 2 is formed on the mounting surface. The sub-mount wiring part 3a of the sub-mount 3 is formed away from the mounting part of the LED chip 2, and the mounting part of the sub-mount 3 is formed so that the reflection factor of light radiated from the LED chip 2 may be larger than that from the sub-mount wiring part 3a of the sub-mount 3. <P>COPYRIGHT: (C)2008,JPO&INPIT |
