| 摘要 |
<P>PROBLEM TO BE SOLVED: To discharge an adhesive well at the time of packaging. <P>SOLUTION: The semiconductor device comprises a semiconductor substrate 10 on which an integrated circuit 12 is formed and a passivation film 16 is formed to expose at least a part of an electrode 14 connected electrically with the integrated circuit 12, a resin layer 24 formed on the passvation film 16 of the semiconductor substrate 10, and an interconnect 28 formed on the resin layer 24 from above the electrode 14 to be connected electrically therewith. Recesses 22 and 26 communicating with the space above the passvation film 16 are formed in the opposing surfaces of the passvation film 16 and the resin layer 24. <P>COPYRIGHT: (C)2008,JPO&INPIT |
