| 摘要 |
The invention relates to a method for the soldering connection at least of one electronic component (104, 204, 304, 404, 504) to a carrier plate (100, 200, 300, 400, 500), wherein the carrier plate has at least one carrier plate contact surface (102, 202, 302, 402, 502) and the at least one electronic component has at least one corresponding component contact surface (105), wherein the at least one carrier plate contact surface is surrounded by a solder resist layer (101, 201, 301, 401, 401) that abuts the at least one carrier plate contact surface, wherein the method comprises the following steps: a) applying, at least in sections, solder paste (106, 206, 306, 406, 506) to the solder resist layer (101, 201, 301, 401, 501) and with minimal overlapping with the carrier plate contact surface (102, 202, 302, 402, 502) abutting the solder resist layer; b) providing the carrier plate with the at least one electronic component (104, 204, 304, 404, 504), wherein the at least one component contact surface (105) at least partially covers the corresponding at least one carrier plate contact surface (102, 202, 302, 402, 502); and c) heating the solder paste (106, 206, 306, 406, 506) to produce a soldered connection between the carrier plate and the at least one component. |
