| 摘要 |
There is provided an electronics module. The electronics module includes a circuit board. The circuit board includes electronic equipment. The electronics module includes a housing. The housing encloses the circuit board. The electronics module includes a thermally conductive panel. The thermally conductive panel at least partly covers at least two opposite side surfaces of the housing. There is also provided an arrangement including at least two such electronics modules. There is also provided a method for providing such an electronics module. |
