发明名称 FLOATING HEAT SINK SUPPORT WITH COPPER SHEETS AND LED PACKAGE ASSEMBLY FOR LED FLIP CHIP PACKAGE
摘要 A floating heat sink support with copper sheets for a LED flip chip package may include least two copper sheets and a flexible polymer for fixing the copper sheets, where the copper sheets separated from each other, and where each of the copper sheets is electrically connected with a positive or negative pole of a LED flip chip. Further, a LED package assembly may comprise the floating heat sink support as mentioned above and one or more LED chips welded in a flip chip manner on the floating heat sink support. A number of copper sheets in the floating heat sink support are heated separately and expand separately to avoid the breakage of a chip substrate resulting from the thermal expansion of a whole bulk of copper sheet, thereby improving the reliability of the LED package structure and prolonging the service life of a LED light source.
申请公布号 US2016308106(A1) 申请公布日期 2016.10.20
申请号 US201615193097 申请日期 2016.06.26
申请人 Cheng Yung Pun 发明人 Cheng Yung Pun
分类号 H01L33/64;F28F21/06;F28F9/007;F28F21/08 主分类号 H01L33/64
代理机构 代理人
主权项 1. A floating heat sink support with copper sheets for a light emitting diode (LED) flip chip package, comprising: at least two copper sheets; and a flexible polymer embedded in grooves on side surfaces of the copper sheets; wherein each two adjacent copper sheets are separated from each other to form a gap above which a LED flip chip is arranged across two adjacent copper sheets, and each of the copper sheets is electrically connected with a positive or negative pole of the LED flip chip; and wherein the copper sheets are placed and located on the flexible polymer
地址 Hong Kong HK