发明名称 |
FLOATING HEAT SINK SUPPORT WITH COPPER SHEETS AND LED PACKAGE ASSEMBLY FOR LED FLIP CHIP PACKAGE |
摘要 |
A floating heat sink support with copper sheets for a LED flip chip package may include least two copper sheets and a flexible polymer for fixing the copper sheets, where the copper sheets separated from each other, and where each of the copper sheets is electrically connected with a positive or negative pole of a LED flip chip. Further, a LED package assembly may comprise the floating heat sink support as mentioned above and one or more LED chips welded in a flip chip manner on the floating heat sink support. A number of copper sheets in the floating heat sink support are heated separately and expand separately to avoid the breakage of a chip substrate resulting from the thermal expansion of a whole bulk of copper sheet, thereby improving the reliability of the LED package structure and prolonging the service life of a LED light source. |
申请公布号 |
US2016308106(A1) |
申请公布日期 |
2016.10.20 |
申请号 |
US201615193097 |
申请日期 |
2016.06.26 |
申请人 |
Cheng Yung Pun |
发明人 |
Cheng Yung Pun |
分类号 |
H01L33/64;F28F21/06;F28F9/007;F28F21/08 |
主分类号 |
H01L33/64 |
代理机构 |
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代理人 |
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主权项 |
1. A floating heat sink support with copper sheets for a light emitting diode (LED) flip chip package, comprising:
at least two copper sheets; and a flexible polymer embedded in grooves on side surfaces of the copper sheets; wherein each two adjacent copper sheets are separated from each other to form a gap above which a LED flip chip is arranged across two adjacent copper sheets, and each of the copper sheets is electrically connected with a positive or negative pole of the LED flip chip; and wherein the copper sheets are placed and located on the flexible polymer |
地址 |
Hong Kong HK |