发明名称 |
STRUCTURE AND METHOD OF SEMICONDUCTOR DEVICE STRUCTURE WITH GATE |
摘要 |
A semiconductor device structure is provided. The semiconductor device structure includes a semiconductor substrate. The semiconductor device structure includes a gate stack over the semiconductor substrate. The semiconductor device structure includes spacers over opposite sidewalls of the gate stack. The spacers and the gate stack surround a recess over the gate stack. The semiconductor device structure includes a first insulating layer over the gate stack and an inner wall of the recess. The semiconductor device structure includes a second insulating layer over the first insulating layer. Materials of the first insulating layer and the second insulating layer are different, and a first thickness of the first insulating layer is less than a second thickness of the second insulating layer. |
申请公布号 |
US2016307758(A1) |
申请公布日期 |
2016.10.20 |
申请号 |
US201514689647 |
申请日期 |
2015.04.17 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
LI Jing-Yang;WU Chun-Sheng;LIU Ding-I;LI Yi-Fang |
分类号 |
H01L21/28;H01L29/423;H01L29/78;H01L29/66;H01L21/02 |
主分类号 |
H01L21/28 |
代理机构 |
|
代理人 |
|
主权项 |
1. A semiconductor device structure, comprising:
a semiconductor substrate; a gate stack over the semiconductor substrate, wherein the gate stack comprises a gate dielectric layer and a metal gate; spacers over opposite sidewalls of the gate stack, wherein the spacers and the gate stack surround a recess over the gate stack; a first insulating layer over the gate stack and an inner wall of the recess, wherein a top surface of the gate dielectric layer is between the semiconductor substrate and a bottom surface of the first insulating layer; and a second insulating layer over the first insulating layer, wherein materials of the first insulating layer and the second insulating layer are different, and a first thickness of the first insulating layer is less than a second thickness of the second insulating layer. |
地址 |
Hsin-Chu TW |