| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component built-in wiring board capable of strengthening fixture of an electronic component within a cavity further than the prior arts, and a manufacturing method thereof.SOLUTION: In an electronic component built-in wiring board 10, a laminated core substrate 11 is formed by alternately laminating a plurality of first insulation resin layers 12 and a plurality of first conductive layers 13. A small cavity 16A is formed through the three first insulation resin layers 12. A large cavity 16B is formed through the five first insulation resin layers 12, on the other hand. Commonly for the small cavity 16A and the large cavity 16B, a central insulation resin layer 12A is positioned in centers of the cavities 16A and 16B in a thickness direction.SELECTED DRAWING: Figure 1 |
