| 摘要 |
PROBLEM TO BE SOLVED: To provide a technique advantageous for improving heat dissipation efficiency of a housing while reducing the influence of the heat generated in each circuit board in the housing on a sensor panel.SOLUTION: A radiation imaging device comprises: a sensor panel; a first circuit board; a second circuit board having a larger heat output than the first circuit board; and a housing. The housing includes a plate-like first member, and a second member located on the side opposite to the first member and including a first portion in which the distance from the first member serves as a first distance and a second portion in which the distance from the first member serves as a second distance larger than the first distance. The first circuit board is arranged between the sensor panel and the second member, and the second circuit board is arranged between the first circuit board and the second portion.SELECTED DRAWING: Figure 1 |
