| 发明名称 |
WAFER LEVEL PACKAGE |
| 摘要 |
A water level package includes a substrate, a plurality of semiconductor chips mounted on the substrate, and molding members that contact the substrate and the plurality of semiconductor chips and are formed on the substrate. The molding members include two or more molding members that have coefficients of thermal expansion (CTEs) different from each other. |
| 申请公布号 |
US2016365319(A1) |
申请公布日期 |
2016.12.15 |
| 申请号 |
US201615002749 |
申请日期 |
2016.01.21 |
| 申请人 |
Samsung Electronics Co., Ltd. |
发明人 |
RYU Han-Sung;CHO Kyong-soon |
| 分类号 |
H01L23/00;H01L23/29 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A wafer level package comprising:
a substrate; a plurality of semiconductor chips mounted on the substrate; and molding members on the substrate, the molding members contacting the substrate and the plurality of semiconductor chips, wherein the molding members include two or more molding members that have coefficients of thermal expansion (CTEs) different from each other. |
| 地址 |
Suwon-si KR |
