发明名称 |
CONFORMAL STRIPPABLE CARBON FILM FOR LINE-EDGE-ROUGHNESS REDUCTION FOR ADVANCED PATTERNING |
摘要 |
Embodiments of the disclosure relate to deposition of a conformal organic material over a feature formed in a photoresist or a hardmask, to decrease the critical dimensions and line edge roughness. In various embodiments, an ultra-conformal carbon-based material is deposited over features formed in a high-resolution photoresist. The conformal organic layer formed over the photoresist thus reduces both the critical dimensions and the line edge roughness of the features. |
申请公布号 |
US2016365248(A1) |
申请公布日期 |
2016.12.15 |
申请号 |
US201615137486 |
申请日期 |
2016.04.25 |
申请人 |
Applied Materials, Inc. |
发明人 |
MEBARKI Bencherki;MANNA Pramit;MIAO Li Yan;PADHI Deenesh;KIM Bok Hoen;BENCHER Christopher Dennis |
分类号 |
H01L21/033;H01L21/3105;H01L21/311;H01L21/027;H01L21/02 |
主分类号 |
H01L21/033 |
代理机构 |
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代理人 |
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主权项 |
1. A method of processing a substrate, comprising:
forming a pattern in a photoresist layer on a hardmask layer, the pattern forming one or more features which expose a portion of the hardmask layer; depositing a conformal organic layer directly on the photoresist layer, the deposition of the conformal organic layer comprising:
introducing a hydrocarbon source, a plasma-initiating gas, and a dilution gas into the processing chamber;generating a plasma in the processing chamber to deposit a conformal organic layer on the patterned features and the exposed portion of the hardmask; removing the conformal organic layer from the bottom portion by an etch process; etching the exposed portion of the hardmask layer to form a recess in the hardmask layer; and removing the remaining portions of the conformal organic layer and patterned photoresist layer simultaneously by a plasma ashing method. |
地址 |
Santa Clara CA US |