METHOD OF SURFACE-MOUNTING COMPONENTS

摘要

A method of connecting a plurality of electronic components (103) to a flexible circuit board (107) comprises: providing a carrier substrate (105) carrying the electronic components (103), each of the electronic components (103) having at least one electrical contact coated with electrically conductive adhesive (102); and applying the carrier substrate (105) to the flexible circuit board (106) such that the electronic components (103) are adhered to the flexible circuit board (106) in electrical contact therewith via the conductive adhesive (102). The electronic components (103) may comprise LEDs and there may be provided one or more optical layers over the flexible circuit board (106).