| 摘要 |
PROBLEM TO BE SOLVED: To improve polishing efficiency by providing a plurality of polishing points for mirror finishing the chamfered part and outer peripheral surface of a semiconductor wafer. SOLUTION: A semiconductor wafer mirror finishing device is composed of a pair of polishing drums 4 that can be elevated by a drum elevating driving means 6, with drum rotation axes 4a parallel with each other; a drum drive source 5; at least one chuck driving means 13 comprising a chuck 15 for holding a semiconductor wafer 10 to be mirror finished, and a chuck drive source; an angle adjusting means 1 for inclining the chuck driving means 13 so as to make the chamfered part and outer peripheral surface of the semiconductor wafer 10 to simultaneously abut the respective polishing drums 4; an oscillating means for supporting the chuck driving means 13 oscillatingly by a supporting shaft 20 parallel with the drum rotation axis 4a; and an energizing means 8 for energizing the chuck driving means 13 in an orthogonal direction to a centerline connecting the center of each polishing drum 4. The chamfered part and outer peripheral surface of the semiconductor wafer 10 can therefore be mirror finished simultaneously at a plurality of polishing points.
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