发明名称 LASER BEAM MACHINING APPARATUS AND METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To attain highly accurate laser beam machining by preventing deviation of an irradiation position of a laser beam caused by thermal deformation of a workpiece. <P>SOLUTION: An apparatus 20 for performing laser beam machining on a prescribed region by irradiating a plurality of positions of a workpiece 32 with a laser beam is provided with: a machining stage 25 for placing the workpiece 32 on; a machining stage driving means 26 for moving the machining stage 25 to the plurality of positions; a position detecting means 27 for detecting the positions of the machining stage 25; a thickness measuring means 29 for measuring the thickness of the workpiece 32; and a control means 31 that, on the basis of the machining conditions of the workpiece 32, picks up a specific correction pattern from those for a plurality of machining conditions which are preliminarily stored and that, by the correction pattern so picked up, controls to correct the irradiation positions of the laser beam. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2007237199(A) 申请公布日期 2007.09.20
申请号 JP20060059784 申请日期 2006.03.06
申请人 SUMITOMO HEAVY IND LTD 发明人 TANAKA KENTA
分类号 B23K26/00;B23K26/02;B23K26/08 主分类号 B23K26/00
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