发明名称 THERMOSETTING ADHESIVE AND BONDING METHOD, AS WELL AS RESIN LAMINATE-TYPE IC CARD
摘要 <P>PROBLEM TO BE SOLVED: To provide an adhesive excellent in chemical resistance, firmly bonding a base material made of a crystalline polyester resin, in which the thickness of an adhesive layer can be freely controlled. <P>SOLUTION: A thermosetting adhesive used for bonding a first base material and a second base material, by coating the adhesive on the first base material and/or the second base material, at least one of the base materials being made of a crystalline polyester resin, using a printing process, and then drying the adhesive, bonding the first base material and the second base material by way of the coated and dried adhesive, and curing the adhesive while pressing the first base material and the second base material with heat, the thermosetting adhesive being characterized by containing (a) an amorphous polyester resin having a hydroxy group, (b) a polyfunctional polyisocyanate, (c) a solvent which dissolves the amorphous polyester resin and (d) a thixotropy-imparting agent. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007321004(A) 申请公布日期 2007.12.13
申请号 JP20060150451 申请日期 2006.05.30
申请人 TAIYO INK MFG LTD 发明人 NICHIMA YUKITOMO;USHIKI SHIGERU
分类号 C09J175/06;B42D15/10;C08G18/42;C09J11/02;C09J167/00;G06K19/077 主分类号 C09J175/06
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